Laser Wafer Marking
Laser Wafer Marking for wafer identification and marking the individual die [and here] can be accomplished with the LP9000U 355nm series and the LP9500 532nm series. Our wafer marking systems are compliant with Semi Standards S2-S8. Additionally, we are fully compliant GEM interfaces for marking 100mm 150mm and 300mm silicon. Text dot matrix or format and machine readable bar codes marked with format and location compliant to SEMI S2-S8 standards of marked silicon wafer with automation and 355nm UV LP9000U.
Why Laser Wafer Marking?
There are many potential reasons to use the LP9000 series of for wafer marking:
- In applications where die are used, dicing control guidance systems for GPS packages used by the Military, law enforcement, and civilian populations. Marking bar code [usually Data Matrix or 2D but can be ID] and /or human readable text tied to a track and trace or e-pedigree program. If GPS system failure occurs, the e-pedigree details allows tracking back to the silicon; from which the guidance system chips were diced to determine if there is systematic failure related to the silicon.
- In production systems, individual wafer die are marked as good or bad relative to the performance standards from the chips information on test results from tester machines. These can be fed to the marking station so the chips can be labeled with a good mark or bad mark and the bad chips are ejected in downstream production. This makes sure they never make their way into finished product, there by reducing manufacturing costs, protection consumers and products and eliminating or greatly reducing scrap products.
What is Laser Wafer Marking?
Discussed here is not soft wafer marking. However, soft marking is defined as nearly completely invisible to the eye and even to machine vision systems with lighting. True soft wafer marking is visible only under certain conditions. When the it is wet or has been cooled to -5 degrees C, this type of marking can be accomplished with the LP9000U 355nm automation.
What is discussed here a form or wafer marking that generally runs 1µm to 6µm deep and melts the silicon. This forms readable text and bar codes. Automation is available from Worldwide to accomplish these goals within several different configurations:
- Manual systems with individual wafers loaded by operators are generally used in R&D labs. For proof of concept production runs can be view here and here.
- Automated systems with mapping, robot and end effectors loading and unloading wafer cassette’s, wafer marking vacuum chucks, and semi standard compliant processing the full GEM interface. These systems can be operated remotely [via a host or production system] or locally via an operator and can be view here and here and here.
- Automated systems with FOUPS for 150mm 300mm and 450mm wafers, where no operators touch the wafers and true lights our handling is possible.
About Worldwide Laser Service Corporation [WLSC]
WLSC founded July of 1986 in Phoenix AZ 85009 and currently with headquarters in Gilbert AZ 85233 is the premier system integration expert in marking systems. WLSC was focused at the time of founding on semi-conductor and discrete electronics parts, such as To220 and Sot23’s. The lasers that were used were generally LP2500 series. T.E.A. atmospheric systems tied to handler and testers for running the semi-conductor part and discrete components often on reel to reel feeders and at rates exceeding 90,000 parts per hour. WLSC followed N. American electronics manufactures to Central and South American and S.E. Asia creating a very strong foreign business. Now has customers and end users throughout N. American and in ten  other countries outside N. America. The evolution of WLSC into wafer marking system was a natural fit given our history in and understand of the semiconductor and electronics market. WLSC has the ability to build, design, install, and maintain automation with several different platforms for Co2, Fiber/YAG, UV-355nm, and newly introduced Geen-532nm series. The LP9000U at 355nm and LP9500 at 532nm are ideally suited for marking pharmaceutical tablets. The system engineers at WLSC have a combined 100+ years’ experience in running applications tests and for end users to make sure the correct platforms are chosen for the end users requirements and then to design, build, and install the integrated solution. WLSC has an applications lab in our Gilbert AZ facility with Co2, YAG\Fiber, UV and Green series coupled with either galvo scanner heads or fixed beam deliveries for testing products. Our mission at WLSC is to reduce manufacturing costs, protect products and consumers, and provide an Eco-Friendly green manufacturing environment, at Worldwide Laser we know LASERS and we look forward to working with you and your facilities for automation matters, contact WLSC at any time, we look forward to hearing from you.
Some details about soft marking shared in this article and for added detail can be found here